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Hynix Develops 1GB Mobile DRAM
By: Shayne Rana   |   Aug 15, 2007

All those out there and myself included, who have complaints about how slow your mobile phone are in for a pleasant surprise. Hynix Semiconductor has apparently come up with what they say is the smallest 1GB mobile DRAM. And considering that these RAMs are pretty much used in all forms of today’s electronics like digital still and video cameras, PDAs, PMPs, and GPS Navigation systems aren’t we glad the guys down at Hynix came up with this! It was in December of 2006 that they announced their 512Mbit Mobile DRAM.

The product is apparently also the industry’s first commercially available 1Gb mobile DRAM built on Hynix’s 66 nm process technology. The finer processing geometry reduces is die size but could also improve speed and power characteristics of the device.


It operates at a maximum clock speed of 200MHz resulting in a throughput of up to 1.6 Gbytes of data per second with a 32-bit I/O. The product consumes less power, under worst-case conditions this could also help extend battery life in a wide range of portable electronic devices.

The 1GB Mobile DRAM is one product in Hynix’s family of ‘One Chip Solutions’ that combine SDRAM/DDR DRAM interfaces, and x16/x32 organizations on a single chip, allowing Hynix the flexibility of offering wire bonded options to meet the specific needs of the customer.

Hynix plans to begin mass production from the first quarter of 2008. The product will be available as ‘NAND flash Multi-Chip Package (NAND MCP)’, which combines DRAM and NAND flash in a single package, or ‘package-on-package (POP)’stack. It will also be offered as ‘KGD (Known Good Die)’ for System in Package (SIP) applications.
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